Projects per year
Personal profile
Expertise related to UN Sustainable Development Goals
In 2015, UN member states agreed to 17 global Sustainable Development Goals (SDGs) to end poverty, protect the planet and ensure prosperity for all. This person’s work contributes towards the following SDG(s):
Fingerprint
- 1 Similar Profiles
Collaborations and top research areas from the last five years
-
Electromigration Lifetime Characterization under Realistic Chip Operating Conditions
UNIVERSITY OF TEXAS AT DALLAS, SEMICONDUCTOR RESEARCH CORPORATION
1/1/24 → 12/31/24
Project: Research project
-
Characterization and Modeling of Single Event Effects in Commercial DRAM Chips
10/12/22 → 10/11/24
Project: Research project
-
ASCENT: TUNA: TUnable randomness for NAtural computing
THE NATIONAL SCIENCE FOUNDATION
10/1/22 → 9/30/26
Project: Research project
-
ASCENT: TUNA: TUnable randomness for NAtural computing
Sapatnekar, S. S., Wang, J., Kim, C. H. & Karpuzcu, U.
10/1/22 → 9/30/26
Project: Research project
-
-
An Ising solver chip based on coupled ring oscillators with a 48-node all-to-all connected array architecture
Lo, H., Moy, W., Yu, H., Sapatnekar, S. & Kim, C. H., Oct 2023, In: Nature Electronics. 6, 10, p. 771-778 8 p.Research output: Contribution to journal › Article › peer-review
Open Access2 Scopus citations -
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution
Kteyan, A., Sukharev, V., Volkov, A., Choy, J. H., Najm, F. N., Yi, Y. H., Kim, C. H. & Moreau, S., Mar 26 2023, ISPD 2023 - Proceedings of the 2023 International Symposium on Physical Design. Association for Computing Machinery, p. 124-132 9 p. (Proceedings of the International Symposium on Physical Design).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
Open Access -
Neuro-Symbolic Computing: Advancements and Challenges in Hardware-Software Co-Design
Yang, X., Wang, Z., Hu, X. S., Kim, C. H., Yu, S., Pajic, M., Manohar, R., Chen, Y. & Li, H. H., 2023, (Accepted/In press) In: IEEE Transactions on Circuits and Systems II: Express Briefs. p. 1 1 p.Research output: Contribution to journal › Article › peer-review
-
On-chip Heater Design and Control Methodology for Reliability Testing Applications Requiring over 300∘C Local Temperatures
Yu, H., Yi, Y., Pande, N. & Kim, C. H., 2023, (Accepted/In press) In: IEEE Transactions on Device and Materials Reliability. p. 1 1 p.Research output: Contribution to journal › Article › peer-review
1 Scopus citations -
Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters
Yi, Y. H., Kim, C., Zhou, C., Kteyan, A. & Sukharev, V., 2023, 2023 IEEE International Reliability Physics Symposium, IRPS 2023 - Proceedings. Institute of Electrical and Electronics Engineers Inc., (IEEE International Reliability Physics Symposium Proceedings; vol. 2023-March).Research output: Chapter in Book/Report/Conference proceeding › Conference contribution