A 300-mm wafer-level threedimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding

F. Liu, R. R. Yu, A. M. Young, L. Shi, K. A. Jenkins, X. Gu, N. R. Klymko, S. Purushothaman, S. J. Koester, W. Haensch

Research output: Chapter in Book/Report/Conference proceeding › Chapter

Fingerprint

Dive into the research topics of 'A 300-mm wafer-level threedimensional integration scheme using tungsten through-silicon via and hybrid cu-adhesive bonding'. Together they form a unique fingerprint.