A systematic approach for analyzing and optimizing cell-internal signal electromigration

Gracieli Posser, Vivek Mishra, Palkesh Jain, Ricardo Reis, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

9 Scopus citations

Abstract

Electromigration (EM) in on-chip metal interconnects is a critical reliability failure mechanism in nanometer-scale technologies. This work addresses the problem of EM on signal interconnects within a standard cell. An approach for modeling and efficient characterization of cell-internal EM is developed, incorporating Joule heating effects, and is used to analyze the lifetime of large benchmark circuits. Further, a method for optimizing the circuit lifetime using minor layout modifications is proposed.

Original languageEnglish (US)
Title of host publication2014 IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2014 - Digest of Technical Papers
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages486-491
Number of pages6
EditionJanuary
ISBN (Electronic)9781479962785
DOIs
StatePublished - Jan 5 2015
Event2014 33rd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2014 - San Jose, United States
Duration: Nov 2 2014Nov 6 2014

Publication series

NameIEEE/ACM International Conference on Computer-Aided Design, Digest of Technical Papers, ICCAD
NumberJanuary
Volume2015-January
ISSN (Print)1092-3152

Other

Other2014 33rd IEEE/ACM International Conference on Computer-Aided Design, ICCAD 2014
Country/TerritoryUnited States
CitySan Jose
Period11/2/1411/6/14

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