@inproceedings{32b0481e60624662bd00cd913cbb0566,
title = "Adhesion of tungsten fine lines of SiO2 by micro-wedge scratching",
abstract = "Microscratch testing of thin films has mainly been done with a conical tip. In the wedge scratch technique introduced in this paper, thin film fine lines are scratched by a wedge-shaped diamond tip until a spallation occurs. A near plane strain situation arises, and finite element method (FEM) analysis is applied for more accurate evaluation of the work of adhesion. The material system used to demonstrate the micro-wedge scratch technique is rf-sputtered tungsten on thermally grown SiO2. When scratching a long line, delamination occurs by tow mechanism. At loads above 8-9mN/μm (normal load per unit line width), tensile stresses behind the indenter tip cause the tungsten to crack, and the thin film subsequently curls up. At loads above 11mN/μm, high shear stresses in front of the indenter cause delamination of the tungsten at the interface. This latter event is modeled by FEM using a biomaterial fracture mechanics approach to obtain a practical work of adhesion value.",
author = "{de Bore}, {M. P.} and H. Huang and Nelson, {J. C.} and F. Wang and Gerberich, {William W}",
year = "1994",
language = "English (US)",
isbn = "1558992170",
series = "Materials Research Society Symposium Proceedings",
publisher = "Publ by Materials Research Society",
pages = "609--614",
editor = "Peter Borgesen and Jensen, {Klavs F.} and Pollak, {Roger A.}",
booktitle = "Interface Control of Electrical, Chemical, and Mechanical Properties",
note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",
}