Adhesion strength of Cu/polyimide interfaces by micro-wedge scratching

F. Wang; J. C. Nelson; H. Huang; R. L. Swisher; W. W. Gerberich

doi:10.1557/proc-338-571

Adhesion strength of Cu/polyimide interfaces by micro-wedge scratching

F. Wang, J. C. Nelson, H. Huang, R. L. Swisher, W. W. Gerberich

Chemical Engineering and Materials Science

Research output: Contribution to journal › Conference article › peer-review

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Abstract

The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.

Original language	English (US)
Pages (from-to)	571-576
Number of pages	6
Journal	Materials Research Society Symposium - Proceedings
Volume	338
DOIs	https://doi.org/10.1557/proc-338-571
State	Published - 1994
Event	Proceedings of the 1994 MRS Spring Meeting - San Francisco, CA, USA Duration: Apr 5 1994 → Apr 8 1994

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title = "Adhesion strength of Cu/polyimide interfaces by micro-wedge scratching",

abstract = "The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.",

author = "F. Wang and Nelson, {J. C.} and H. Huang and Swisher, {R. L.} and Gerberich, {W. W.}",

year = "1994",

doi = "10.1557/proc-338-571",

language = "English (US)",

volume = "338",

pages = "571--576",

journal = "Materials Research Society Symposium - Proceedings",

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note = "Proceedings of the 1994 MRS Spring Meeting ; Conference date: 05-04-1994 Through 08-04-1994",

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T1 - Adhesion strength of Cu/polyimide interfaces by micro-wedge scratching

AU - Wang, F.

AU - Nelson, J. C.

AU - Huang, H.

AU - Swisher, R. L.

AU - Gerberich, W. W.

PY - 1994

Y1 - 1994

N2 - The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.

AB - The micro-wedge scratch technique was applied to characterize interfacial properties of copper fine lines on PMDA-ODA polyimide. A 20 μm wide, 0.1 μm radius wedge-shaped diamond tip was used to mechanically debond Cu fine lines from polyimide substrate. Copper fine lines varies from 0.2 to 0.4 μm thick, and from 1 μm to 100 μm wide. Both cohesive and adhesive delaminations were obtained. Load-displacement curves were recorded and the scratch morphologies were observed by SEM. From a first order calculation, the fracture toughness of the polyimide and interfacial strength of Cu-PI were obtained.

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U2 - 10.1557/proc-338-571

DO - 10.1557/proc-338-571

M3 - Conference article

AN - SCOPUS:0028698906

SN - 0272-9172

VL - 338

SP - 571

EP - 576

JO - Materials Research Society Symposium - Proceedings

JF - Materials Research Society Symposium - Proceedings

T2 - Proceedings of the 1994 MRS Spring Meeting

Y2 - 5 April 1994 through 8 April 1994

ER -

Adhesion strength of Cu/polyimide interfaces by micro-wedge scratching

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