Advanced FOUP purge using diffusers for FOUP door-off application

H. P. Wang, S. C. Kim, B. Liu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

In a number of key IC fabrication steps in-process wafers are sensitive to moisture, oxygen and other airborne molecular contaminants in the air. Nitrogen purge of closed Front Opening Unified Pods (FOUP) have been implemented in many fabs to minimize wafer's exposure to the contaminants (or CDA purge if oxygen is not of concern). As the technology node advances, the need for minimizing the exposure has become even more stringent and in some processes requires FOUP purge while the FOUP door is off on an EFEM loadport. This requirement brings unique challenges to FOUP purge, especially at the front locations near FOUP opening, where EFEM air constantly tries to enter the FOUP. In this paper we present Entegris' latest experimental study on understanding the unique challenges of FOUP door-off purge and the excellent test results of newly designed advanced FOUP with purge flow distribution manifolds (diffusers).

Original languageEnglish (US)
Title of host publication25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages120-124
Number of pages5
ISBN (Print)9781479939442
DOIs
StatePublished - Jan 1 2014
Event25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014 - Saratoga Springs, NY, United States
Duration: May 19 2014May 21 2014

Publication series

NameASMC (Advanced Semiconductor Manufacturing Conference) Proceedings
ISSN (Print)1078-8743

Other

Other25th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2014
CountryUnited States
CitySaratoga Springs, NY
Period5/19/145/21/14

Fingerprint Dive into the research topics of 'Advanced FOUP purge using diffusers for FOUP door-off application'. Together they form a unique fingerprint.

Cite this