Advanced laminated antiferromagnetically coupled recording media with high thermal stability

S. I. Pang; S. N. Piramanayagam; J. P. Wang

doi:10.1063/1.1436281

Advanced laminated antiferromagnetically coupled recording media with high thermal stability

S. I. Pang, S. N. Piramanayagam, J. P. Wang

Electrical and Computer Engineering

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16 Scopus citations

Abstract

A layered structure to improve the antiferromagnetic exchange coupling constant (J) in laminated antiferromagnetically coupled (LAC) media is proposed. This structure has a much larger thermal stability in comparison to simple LAC structures. It also improves the coercivity and decreases the remnant moment-thickness product to achieve a high resolution and a low pulse width. The recording measurements indicate that this structure has a slightly larger noise than the simple LAC structures. However, its overall signal-to-noise ratio (SNR) is comparable to that of the simple LAC structures. High SNR and much higher thermal stability make this structure suitable for ultrahigh areal densities.

Original language	English (US)
Pages (from-to)	616-618
Number of pages	3
Journal	Applied Physics Letters
Volume	80
Issue number	4
DOIs	https://doi.org/10.1063/1.1436281
State	Published - Jan 28 2002

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Advanced laminated antiferromagnetically coupled recording media with high thermal stability

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