Algorithms for non-hanan-based optimization for VLSI interconnect under a higher-order AWE model

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Abstract

To improve the performance of critical nets where both timing and wire resources are stringent, we integrate buffer insertion and driver sizing separately with non-Hanan optimization and propose two algorithms: simultaneous buffer insertion and non-Hanan optimization (BINO) and full-plane AWE routing with driver sizing (FAR-DS). For BINO, we consider the realistic situation that buffer locations are restricted to a limited set of available spaces after cell placement. The objective of BINO is to minimize a weighted sum of wire and buffer costs subject to timing constraints. To achieve this objective, we suggest a greedy algorithm that considers two operations independently: iterative buffer insertion and iterative buffer deletion. Both are conducted simultaneously with non-Hanan optimization until the improvement is exhausted. For FAR-DS, we investigate the curvature property of the sink delay as a function of both connection location and driver stage ratio in a two-dimensional (2-D) space. The objective of FAR-DS is to minimize a weighted sum of wire and driver cost while ensuring that the timing constraints are satisfied. Based on the curvature property, we search for the optimal solution in the continuous 2-D space. In both BINO and FAR-DS, a fourth-order AWE delay model is employed to assure the quality of optimization. Experiments of BINO and FAR-DS on both integrated circuit and MCM technologies showed significant cost reductions compared with SERT and MVERT in addition to making the interconnect to satisfy timing constraints.

Original languageEnglish (US)
Pages (from-to)446-458
Number of pages13
JournalIEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Volume19
Issue number4
DOIs
StatePublished - 2000

Bibliographical note

Funding Information:
Manuscript received October 11, 1999. This work is supported in part by the Semiconductor Research Corporation under contract 98-DJ-609 and the National Science Foundation (NSF) under award CCR-9800992. This paper was recommended by Associate Editor M. Wong. The authors are with the Department of Electrical and Computer Engineering, University of Minnesota, Minneapolis, MN 55455 USA. Publisher Item Identifier S 0278-0070(00)03224-3.

Keywords

  • Buffer-insertion, deep-submicron, interconnect, performance-optimization, physical-design, routing, transistor-sizing, vlsi

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