An ISM band CMOS integrated wireless telemetry transceiver (in A 0.18 μm copper CMOS process)

J. Kim, R. Harjani

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

A 900 MHz CMOS BFSK transceiver is used as a test vehicle to evaluate the impact of copper interconnect on CMOS RF circuit performance. The RF front-end contains spiral inductors and fractal capacitors, whose parasitics degrade the receiver sensitivity. It is shown that spiral inductor quality factors (Qs) are on average 70% higher when copper interconnect is used in place of aluminum, while capacitor Qs are also improved significantly. As a result, the front-end receiver gain is increased by nearly 4 dB and the receiver noise figure is reduced by more than 1 dB when copper is used instead of aluminum. The 20 mW transceiver fabricated in the 0.18 μm copper UMC process can achieve a 0.1% BER for a - 98 dBm input, while operating at 200 kb/s data. The maximum power output of transmit section is +10 dBm.

Original languageEnglish (US)
Pages (from-to)2813-2817
Number of pages5
JournalIEEE Vehicular Technology Conference
Volume4
Issue number53ND
StatePublished - Jan 1 2001
EventIEEE VTS 53rd Vehicular Technology Conference (VTS SPRING 2001) - Rhodes, Greece
Duration: May 6 2001May 9 2001

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