Analytical study on a new bond test method for measuring adhesion

Y. S. Cheng, W. H. Douglas, A. Versluis, D. Tantbirojn

Research output: Contribution to journalArticlepeer-review

13 Scopus citations

Abstract

A new bond strength test method proposed by Lin et al. (Lin CP, Douglas WH, Fields RP. J Dent Res 1992;71(IADR Abstracts #74):524) is presented to overcome the shortcomings of traditional bond strength measurements, which are based on nominal stress concepts. This paper is a theoretical analysis based on a linear elastic fracture mechanics approach. The analytical relationship between the elastic energy release rate GIc and the critical load is derived approximately as a function of specimen shape and material properties.

Original languageEnglish (US)
Pages (from-to)117-123
Number of pages7
JournalEngineering Fracture Mechanics
Volume64
Issue number1
DOIs
StatePublished - Sep 1999

Keywords

  • Adhesion
  • Adhesive strength
  • Bond strength test
  • Fracture mechanics

Fingerprint Dive into the research topics of 'Analytical study on a new bond test method for measuring adhesion'. Together they form a unique fingerprint.

Cite this