@inproceedings{04f1960cc9234cc08e5819a5acde9971,
title = "Analyzing the electromigration effects on different metal layers and different wire lengths",
abstract = "Electromigration (EM) is a significant problem in integrated circuits and can seriously damage interconnect wires and vias, reducing the circuit's lifetime. In this paper we are simulating the EM effects on 6 different metal layers for different wire lengths incorporating Joule heating effects. The layouts are constructed considering the 45nm technology and scaled to 22nm technology. We are simulating the EM effects considering three different wire lengths, 100μm, 200μm and 300μm in 22nm technology for a reference frequency of 2GHz. The delay is also analyzed and it increases when the wire length increases and decreases for a higher metal layer.",
keywords = "AC Electromigration, Electromigration, Physical Design, Signal Wires",
author = "Gracidi Posser and Vivek Mishra and Ricardo Reis and Sapatnekar, {Sachin S}",
year = "2014",
month = jan,
day = "1",
doi = "10.1109/ICECS.2014.7050077",
language = "English (US)",
series = "2014 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "682--685",
booktitle = "2014 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014",
note = "2014 21st IEEE International Conference on Electronics, Circuits and Systems, ICECS 2014 ; Conference date: 07-12-2014 Through 10-12-2014",
}