TY - JOUR
T1 - Buffering global interconnects in structured ASIC design
AU - Zhang, Tianpei
AU - Sapatnekar, Sachin S.
PY - 2008/2/1
Y1 - 2008/2/1
N2 - Structured ASICs present an attractive alternative to reducing design costs and turnaround times in nanometer designs. As with conventional ASICs, such designs require global wires to be buffered. However, via-programmable designs must prefabricate and preplace buffers in the layout. This paper proposes a novel and accurate statistical estimation technique for distributing prefabricated buffers through a layout. It employs Rent's rule to estimate the buffer distribution required for the layout, so that an appropriate structured ASIC may be selected for the design. Experimental results show that the buffer distribution estimation is accurate and economic, and that a uniform buffer distribution can maintain a high degree of regularity in design and shows a good timing performance, comparable with nonuniform buffer distribution.
AB - Structured ASICs present an attractive alternative to reducing design costs and turnaround times in nanometer designs. As with conventional ASICs, such designs require global wires to be buffered. However, via-programmable designs must prefabricate and preplace buffers in the layout. This paper proposes a novel and accurate statistical estimation technique for distributing prefabricated buffers through a layout. It employs Rent's rule to estimate the buffer distribution required for the layout, so that an appropriate structured ASIC may be selected for the design. Experimental results show that the buffer distribution estimation is accurate and economic, and that a uniform buffer distribution can maintain a high degree of regularity in design and shows a good timing performance, comparable with nonuniform buffer distribution.
KW - Buffer insertion
KW - Interconnect
KW - Physical design
KW - Rent's rule
KW - Structured ASIC
UR - http://www.scopus.com/inward/record.url?scp=36048952998&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=36048952998&partnerID=8YFLogxK
U2 - 10.1016/j.vlsi.2007.04.002
DO - 10.1016/j.vlsi.2007.04.002
M3 - Article
AN - SCOPUS:36048952998
VL - 41
SP - 171
EP - 182
JO - Integration, the VLSI Journal
JF - Integration, the VLSI Journal
SN - 0167-9260
IS - 2
ER -