Fingerprint
Dive into the research topics of 'Carrier mobility enhancement in strained Si-On-Insulator fabricated by wafer bonding'. Together they form a unique fingerprint.- Sort by
- Weight
- Alphabetically
Carrier mobility enhancement in strained Si-On-Insulator fabricated by wafer bonding
L. J. Huang, J. O. Chu, S. Goma, C. P. D'Emic, S. J. Koester, D. F. Canaperi, P. M. Mooney, S. A. Cordes, J. L. Speidell, R. M. Anderson, H. S. Philip Wong
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
41
Scopus
citations