Computer simulation system of silicon anisotropic etching

Yanfeng Jiang, Qing'an Huang

Research output: Contribution to journalArticlepeer-review

Abstract

Wet chemical etching of silicon in anisotropic etchants, such as KOH, is a standard technique of bulk-micromaching to fabricate three-dimensional structures for microelectromechanical silicon sensors and actuators. The work involved in this article, belonging to the domain of MEMS CAD, just wants to simulate the etching process. In it, introduction has been made on how to establish computer simulation system of silicon anisotropic etching. The simulator's structural diagram has been listed, too. Some important aspects in tiffs simulator, such as the foundation of etch rate database, user's input interface, data management module, are narrated. A software edited by Borland C, which is based on the computer simulation system, has been completed to model the actual result of silicon anisotropic etching. Its interface and result are shown in this article, too. The output result of this software shows that it is reasonable to establish the silicon anisotropic etching model system in the above simulator's structural diagram.

Original languageEnglish (US)
Pages (from-to)484-487
Number of pages4
JournalJixie Qiangdu/Journal of Mechanical Strength
Volume23
Issue number4
StatePublished - Dec 1 2001

Keywords

  • Computer simulation
  • Micro-electro-mechanical system
  • Silicon anisotropic etching

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