TY - GEN
T1 - Development of energy consumption ratio test
AU - Sun, Xiaoyun
AU - Kinney, L.
AU - Vinnakota, B.
PY - 2003/1/1
Y1 - 2003/1/1
N2 - Dynamic Idd test methods have been shown to detect defects that escape other test techniques. Normal process variations decrease the fault coverage and affect the performance of dynamic Idd test techniques. A dynamic-current based test metric, Energy Consumption Ratio (ECR), has been proposed to address the process variation problem and has been validated through extensive simulations and applications on manufactured circuits. In this paper, we first discuss the problems in practical implementation of ECR tests on large-size circuits of advanced technology, e.g., increased circuit size and leakage current degrade ECR performance. We then propose two possible solutions: one is based on extensive statistical data analysis and another uses an enhanced scan design to partition the circuit. Experimental results from simulations and actual devices are included in this paper.
AB - Dynamic Idd test methods have been shown to detect defects that escape other test techniques. Normal process variations decrease the fault coverage and affect the performance of dynamic Idd test techniques. A dynamic-current based test metric, Energy Consumption Ratio (ECR), has been proposed to address the process variation problem and has been validated through extensive simulations and applications on manufactured circuits. In this paper, we first discuss the problems in practical implementation of ECR tests on large-size circuits of advanced technology, e.g., increased circuit size and leakage current degrade ECR performance. We then propose two possible solutions: one is based on extensive statistical data analysis and another uses an enhanced scan design to partition the circuit. Experimental results from simulations and actual devices are included in this paper.
KW - Energy consumption
KW - Testing
KW - Very large scale integration
UR - http://www.scopus.com/inward/record.url?scp=84943570305&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84943570305&partnerID=8YFLogxK
U2 - 10.1109/VTEST.2003.1197664
DO - 10.1109/VTEST.2003.1197664
M3 - Conference contribution
AN - SCOPUS:84943570305
T3 - Proceedings of the IEEE VLSI Test Symposium
SP - 279
EP - 284
BT - Proceedings - 21st IEEE VLSI Test Symposium, VTS 2003
PB - IEEE Computer Society
T2 - 21st IEEE VLSI Test Symposium, VTS 2003
Y2 - 27 April 2003 through 1 May 2003
ER -