Development of quasi half coax lines for wafer level packaging

Swagata Riki Banerjee, Rhonda Franklin Drayton

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

A 50 ohm micromachined interconnect is designed, fabricated, and measured as a broadband interconnect that is compatible with the standard thickness of wafers. It is developed in two applications: a transition from a commercially available 1 mm connector launch assembly to wafer based systems and an interconnect within wafer level designs. S-parameter measured data is shown for coaxially launched structures up to 35 GHz and for probed launched structures up to 50 GHz. The on-wafer probe launched interconnect exhibits less than 1. 1 dB/cm of attenuation at 50 GHz, reflections less than 15 dB across 50 GHz, and 2.5 times less dispersion than a planar microstrip with comparable dimensions.

Original languageEnglish (US)
Pages (from-to)551-556
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Volume1
StatePublished - Sep 19 2005
Event55th Electronic Components and Technology Conference, ECTC - Lake Buena Vista, FL, United States
Duration: May 31 2005Jun 4 2005

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