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Electron and hole mobility enhancement in strained SOI by wafer bonding
Lijuan Huang, Jack O. Chu, S. A. Goma, C. P. D'Emic, Steven J. Koester, Donald F. Canaperi, Patricia M. Mooney, S. A. Cordes, James L. Speidell, R. M. Anderson, H. S.Philip Wong
Research output: Contribution to journal › Article › peer-review
62
Scopus
citations