Electrothermal analysis and optimization techniques for nanoscale integrated circuits

Yong Zhan, Brent Goplen, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Scopus citations

Abstract

With technology scaling, on-chip power densities are growing steadily, leading to the point where temperature has become an important consideration in the design of electrical circuits. This paper overviews several methods for the analysis and optimization of thermal effects in integrated circuits. Thermal analysis may be carried out efficiently through the use of finite difference methods, finite element methods, or Green function based methods, each of which provides different accuracy-computation tradeoffs, and the paper begins by surveying these. Next, we overview a restricted set of thermal optimization methods, specifically, placement techniques for thermal heat-spreading, and then we conclude by summarizing a set of future directions in electrothermal design.

Original languageEnglish (US)
Title of host publicationProceedings of the ASP-DAC 2006
Subtitle of host publicationAsia and South Pacific Design Automation Conference 2006
Pages219-222
Number of pages4
Volume2006
StatePublished - Sep 19 2006
EventASP-DAC 2006: Asia and South Pacific Design Automation Conference 2006 - Yokohama, Japan
Duration: Jan 24 2006Jan 27 2006

Other

OtherASP-DAC 2006: Asia and South Pacific Design Automation Conference 2006
CountryJapan
CityYokohama
Period1/24/061/27/06

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