Engineering & Materials Science
Indentation
100%
Thin films
88%
Adhesion
85%
Delamination
39%
Nanoindentation
32%
Calibration
20%
Multilayer films
20%
Energy release rate
15%
Refractory materials
14%
Strain energy
14%
Fracture mechanics
13%
Residual stresses
11%
Mechanics
11%
Copper
10%
Microstructure
8%
Physics & Astronomy
indentation
92%
adhesion
78%
thin films
47%
nanoindentation
23%
strain energy release rate
17%
fracture mechanics
13%
refractories
12%
residual stress
10%
tungsten
9%
preparation
8%
copper
8%
microstructure
6%
energy
3%
Chemical Compounds
Delamination
47%
Liquid Film
45%
Fracture Mechanics
20%
Residual Stress
17%
Strain Energy
16%
Multilayer Film
15%
Mechanics
15%
Refractory
13%
Tungsten
12%
Sample Preparation
11%
Microstructure
8%
Volume
7%
Energy
6%
Application
4%