TY - JOUR
T1 - Fast Stochastic Analysis of Electromigration in Power Distribution Networks
AU - Jain, Palkesh
AU - Mishra, Vivek
AU - Sapatnekar, Sachin S.
PY - 2017/9
Y1 - 2017/9
N2 - A fast and stochastic analysis methodology for electromigration (EM) assessment of power distribution networks is presented in this paper. We examine the impact of variability on EM time-to-failure (TTF), considering altered current densities due to global/local process variations as well as the fundamental factors that cause the conventional EM TTF distribution. Through the novel variations-aware current density model based on Hermite polynomial chaos, we demonstrate significant margins in EM lifetime when compared with the traditional worst case approach. On the other hand, we show that the traditional approach is altogether incompetent in handling transistor-level local variations leading to significantly optimistic lifetime estimates for lower metal level interconnects of power delivery network. Subsequently, we attempt to bridge the conventional, component-level EM verification method to the system level failures, inspired by the extreme order statistics. We make use of asymptotic order models to determine the TTF for the k th component failure due to EM, and demonstrate application of this approach in developing IR drop aware system-level failure criteria.
AB - A fast and stochastic analysis methodology for electromigration (EM) assessment of power distribution networks is presented in this paper. We examine the impact of variability on EM time-to-failure (TTF), considering altered current densities due to global/local process variations as well as the fundamental factors that cause the conventional EM TTF distribution. Through the novel variations-aware current density model based on Hermite polynomial chaos, we demonstrate significant margins in EM lifetime when compared with the traditional worst case approach. On the other hand, we show that the traditional approach is altogether incompetent in handling transistor-level local variations leading to significantly optimistic lifetime estimates for lower metal level interconnects of power delivery network. Subsequently, we attempt to bridge the conventional, component-level EM verification method to the system level failures, inspired by the extreme order statistics. We make use of asymptotic order models to determine the TTF for the k th component failure due to EM, and demonstrate application of this approach in developing IR drop aware system-level failure criteria.
KW - Electromigration (EM)
KW - extreme value theory
KW - lognormal distribution
KW - worst case (WC) corner
UR - http://www.scopus.com/inward/record.url?scp=85020702596&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85020702596&partnerID=8YFLogxK
U2 - 10.1109/TVLSI.2017.2706520
DO - 10.1109/TVLSI.2017.2706520
M3 - Article
AN - SCOPUS:85020702596
VL - 25
SP - 2512
EP - 2524
JO - IEEE Transactions on Very Large Scale Integration (VLSI) Systems
JF - IEEE Transactions on Very Large Scale Integration (VLSI) Systems
SN - 1063-8210
IS - 9
M1 - 7945294
ER -