Finite element simulation of strain/stress fields in delaminated plastic IC packages

Devin E. Mix, Avram Bar-Cohen, Kumar K. Tamma

Research output: Contribution to conferencePaperpeer-review

4 Scopus citations

Fingerprint

Dive into the research topics of 'Finite element simulation of strain/stress fields in delaminated plastic IC packages'. Together they form a unique fingerprint.

Engineering & Materials Science