Hardening due to interfacial he bubbles in nanolayered composites

Nan Li; Michael Demkowicz; Nathan Mara; Yongqiang Wang; Amit Misra

doi:10.1080/21663831.2015.1110730

Hardening due to interfacial he bubbles in nanolayered composites

Nan Li, Michael Demkowicz, Nathan Mara, Yongqiang Wang, Amit Misra

Chemical Engineering and Materials Science

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34 Scopus citations

Abstract

A series of helium (He) implantations with varying energies and doses were used to introduce bubbles into interfaces in Cu/Mo, Cu/V and Cu/Nb nanolayered composites. Micro-pillar compression testing revealed that the interfacial He bubbles give rise to modest hardening as compared to those in grain interiors. The flow stress enhancement is proportional to the strength of the un-implanted sample. We discuss the influence of the structure of the interfacial dislocation network, the shear resistance of the interfaces, and atomic-level interface steps on hardening. Interfaces with higher density of misfit dislocation intersections and lower shear resistance tend to provide greater hardening.

Original language	English (US)
Pages (from-to)	75-82
Number of pages	8
Journal	Materials Research Letters
Volume	4
Issue number	2
DOIs	https://doi.org/10.1080/21663831.2015.1110730
State	Published - Dec 15 2015

Bibliographical note

Publisher Copyright:
© 2015 The Author(s). Published by Taylor & Francis.

Keywords

Dislocation slip transmission
Interface shear resistance
Interfacial he bubbles

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title = "Hardening due to interfacial he bubbles in nanolayered composites",

abstract = "A series of helium (He) implantations with varying energies and doses were used to introduce bubbles into interfaces in Cu/Mo, Cu/V and Cu/Nb nanolayered composites. Micro-pillar compression testing revealed that the interfacial He bubbles give rise to modest hardening as compared to those in grain interiors. The flow stress enhancement is proportional to the strength of the un-implanted sample. We discuss the influence of the structure of the interfacial dislocation network, the shear resistance of the interfaces, and atomic-level interface steps on hardening. Interfaces with higher density of misfit dislocation intersections and lower shear resistance tend to provide greater hardening.",

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AU - Li, Nan

AU - Demkowicz, Michael

AU - Mara, Nathan

AU - Wang, Yongqiang

AU - Misra, Amit

PY - 2015/12/15

Y1 - 2015/12/15

N2 - A series of helium (He) implantations with varying energies and doses were used to introduce bubbles into interfaces in Cu/Mo, Cu/V and Cu/Nb nanolayered composites. Micro-pillar compression testing revealed that the interfacial He bubbles give rise to modest hardening as compared to those in grain interiors. The flow stress enhancement is proportional to the strength of the un-implanted sample. We discuss the influence of the structure of the interfacial dislocation network, the shear resistance of the interfaces, and atomic-level interface steps on hardening. Interfaces with higher density of misfit dislocation intersections and lower shear resistance tend to provide greater hardening.

AB - A series of helium (He) implantations with varying energies and doses were used to introduce bubbles into interfaces in Cu/Mo, Cu/V and Cu/Nb nanolayered composites. Micro-pillar compression testing revealed that the interfacial He bubbles give rise to modest hardening as compared to those in grain interiors. The flow stress enhancement is proportional to the strength of the un-implanted sample. We discuss the influence of the structure of the interfacial dislocation network, the shear resistance of the interfaces, and atomic-level interface steps on hardening. Interfaces with higher density of misfit dislocation intersections and lower shear resistance tend to provide greater hardening.

KW - Dislocation slip transmission

KW - Interface shear resistance

KW - Interfacial he bubbles

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Hardening due to interfacial he bubbles in nanolayered composites

Abstract

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Keywords

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