Heat transfer and pressure drop characteristics of arrays of rectangular modules encountered in electronic equipment

Physics & Astronomy

• electronic equipment 100%
• pressure drop 78%
• modules 58%
• heat transfer 55%
• augmentation 21%
• heat transfer coefficients 15%
• ducts 7%
• pressure distribution 7%
• upstream 6%
• implantation 6%
• heat 4%

Engineering & Materials Science

• Heat transfer coefficients 65%
• Pressure drop 63%
• Electronic equipment 59%
• Heat transfer 47%
• Ducts 35%
• Pressure distribution 34%
• Hot Temperature 17%
• Experiments 12%

Chemical Compounds

• Pressure Drop 89%
• Heat Transfer 76%
• Transfer Coefficient 42%
• Pressure 20%
• Heat 13%