High frequency circuit components on micromachined variable thickness substrates

R. F. Drayton, R. M. Henderson, L. P.B. Katehi

Research output: Contribution to journalArticlepeer-review

4 Scopus citations

Abstract

The use of Si micromachining techniques to enhance high frequency planar circuit design flexibility by offering a method for varying the substrate thickness in selective locations on the wafer is presented.

Original languageEnglish (US)
Pages (from-to)303-304
Number of pages2
JournalElectronics Letters
Volume33
Issue number4
DOIs
StatePublished - Feb 13 1997
Externally publishedYes

Keywords

  • Micromachining
  • Microwave circuits
  • Silicon

Fingerprint Dive into the research topics of 'High frequency circuit components on micromachined variable thickness substrates'. Together they form a unique fingerprint.

Cite this