Including thermal vibrations and bonding in HAADF-STEM image simulation

Michael Odlyzko; K. Andre Mkhoyan

doi:10.1017/S1431927614002499

Including thermal vibrations and bonding in HAADF-STEM image simulation

Chemical Engineering and Materials Science

Research output: Contribution to journal › Conference article › peer-review

Original language	English (US)
Pages (from-to)	154-155
Number of pages	2
Journal	Microscopy and Microanalysis
Volume	20
Issue number	3
DOIs	https://doi.org/10.1017/S1431927614002499
State	Published - Aug 1 2014
Event	Microscopy and Microanalysis 2014, M and M 2014 - Hartford, United States Duration: Aug 3 2014 → Aug 7 2014

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title = "Including thermal vibrations and bonding in HAADF-STEM image simulation",

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Including thermal vibrations and bonding in HAADF-STEM image simulation

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