Using ballistic hot electron techniques, we demonstrate lateral spin transport through a bulk Si wafer. Despite a wide spin transport time distribution caused by transport path variation in the 400 μm-thick Si channel, the absence of a buried interface in close proximity increases the observed spin lifetime to approximately 100 ns at 61 K. The relative insensitivity of this lifetime to temperature variation (and its absolute magnitude) indicates a contribution from an extrinsic depolarization mechanism such as disorder and defects at the exposed air/Si interface in the transport region between injector and detector.
Bibliographical noteFunding Information:
This work was supported by the Office of Naval Research and the National Science Foundation. We acknowledge the support of the Maryland NanoCenter and its FabLab.
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