Traditionally, scaling tendencies have been managed using process control methods to reduced deposition rates. This paper examine the thermodynamic principals behind such process modifications while introducing the kinetic steps of the overall deposition pathway. Chemical additives that interfere with and retard the individual steps of the overall scaling mechanism can help to further reduce deposition rates.
|Original language||English (US)|
|Number of pages||8|
|Specialist publication||Tappi journal|
|State||Published - Jun 1 1999|