Micromachined conformal packages for microwave and millimeter-wave applications

Rhonda F. Drayton, Linda P B Katehi

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

High frequency circuit performance is significantly influenced by its RF package configuration. This paper presents the use of Si micromachining to develop a miniature package that conforms to the circuit geometry while providing physical and electromagnetic shielding. The advantages of a conformal package, other than reduced size, are control of package resonances, the capability to isolate individual circuit elements and improve circuit performance through elimination of parasitic radiation. In addition, the use of micromachining provides reduced fabrication tolerances and most importantly lower cost.

Original languageEnglish (US)
Pages (from-to)1387-1390
Number of pages4
JournalIEEE MTT-S International Microwave Symposium Digest
Volume3
StatePublished - Jan 1 1995
EventProceedings of the 1995 IEEE MTT-S International Microwave Symposium. Part 1 (of 3) - Orlando, FL, USA
Duration: May 16 1995May 20 1995

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