MOCVD growth of GaN layer on InN interlayer and relaxation of residual strain

Keon Hun Lee, Sung Hyun Park, Jong Hack Kim, Nam Hyuk Kim, Min Hwa Kim, Hyunseok Na, Euijoon Yoon

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100 nm InN layer was grown on sapphire c-plane using a metal-organic chemical vapor deposition (MOCVD) system. Low temperature (LT) GaN layer was grown on InN layer to protect InN layer from direct exposure to hydrogen flow during high temperature (HT) GaN growth and/or abrupt decomposition. Subsequently, thick HT GaN layer (2.5 μm thick) was grown at 1000 °C on LT GaN/InN/sapphire template. Microstructure of epilayer-substrate interface was investigated by transmission electron microscopy (TEM). From the high angle annular dark field TEM image, the growth of columnar structured LT GaN and HT GaN with good crystallinity was observed. Though thickness of InN interlayer is assumed to be about 100 nm based on growth rate, it was not clearly shown in TEM image due to the InN decomposition. The lattice parameters of GaN layers were measured by XRD measurement, which shows that InN interlayer reduces the compressive strain in GaN layer. The relaxation of compressive strain in GaN layer was also confirmed by photoluminescence (PL) measurement. As shown in the PL spectra, red shift of GaN band edge peak was observed, which indicates the reduction of compressive strain in GaN epilayer.

Original languageEnglish (US)
Pages (from-to)6365-6368
Number of pages4
JournalThin Solid Films
Issue number22
StatePublished - Sep 1 2010


  • GaN
  • InN
  • PL
  • Thermal expansion coefficient
  • Thermal strain
  • XRD


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