Modelling of dynamic ledge heat transfer

Chuck C. Wei, John J J Chen, Barry J. Welch, Vaughan R. Voller

Research output: Chapter in Book/Report/Conference proceedingConference contribution

26 Scopus citations

Abstract

Cell disturbances such as alumina feeding, anode effect, metal-tapping and anode changing often cause variations in the heat balance of a reduction cell, resulting in deviations from the optimum operating conditions. A dynamic thermal model built on an earlier one-dimensional simulation by the authors had been used to solve the transient heat conduction with phase change in the sidewall/ledge region. An improved model based on a moving finite difference method was developed to simulate the dynamic ledging behaviour. Fixed-grid and deforming-grid spacings were respectively superimposed on the sidewall and ledge region in order to track the moving front. Various aspects of the process dynamics with respect to the variation of ledge thickness and sidewall shell temperature were considered.

Original languageEnglish (US)
Title of host publicationLight Metals
Pages309-316
Number of pages8
StatePublished - Dec 1 1997
EventProceedings of the 1997 TMS Annual Meeting - Orlando, FL, USA
Duration: Feb 10 1997Feb 13 1997

Publication series

NameLight Metals: Proceedings of Sessions, TMS Annual Meeting (Warrendale, Pennsylvania)
ISSN (Print)1096-9586

Other

OtherProceedings of the 1997 TMS Annual Meeting
CityOrlando, FL, USA
Period2/10/972/13/97

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