Nano self-assembly for MEMS and microelectronics applications (invited paper)

Tianhong Cui, Yuri Lvov

Research output: Contribution to journalConference articlepeer-review

1 Scopus citations

Abstract

This paper presents the combination of "bottom-up" layer-by-layer (LbL) nano self-assembly and "top-down" micromanufacturing techniques for MEMS and microelectronics applications. Two approaches, modified lift-off and metal mask, were utilized to pattern nano-assembled thin films effectively. With nano self-assembly and surface micromachining. highly flexible nanoparticle-based magnetic cantilever platform for micro sensing and actuation was self-assembled. Self-assembled magnetic thin films on polymeric tunneling sensors were functional as a polymer actuators for the actuation of highly sensitive sensors. For microelectronics devices, self-assembled silica nanoparticle thin film acted as the dielectric layer for field-effect transistors. Nanoparticle- and polymer-based field-effect transistors with embedded nano self-assembled films as dielectric and active layers were fabricated and characterized successfully as well.

Original languageEnglish (US)
Article number603202
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume6032
DOIs
StatePublished - Mar 30 2006
EventICO20: MEMS, MOEMS, and NEMS - Changchun, China
Duration: Aug 21 2005Aug 26 2005

Keywords

  • MEMS
  • Microelectronics
  • Nano Self-Assembly

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