Nanotrench for nano and microparticle electrical interconnects

J. F. Dayen, V. Faramarzi, M. Pauly, N. T. Kemp, M. Barbero, B. P. Pichon, H. Majjad, S. Begin-Colin, B. Doudin

Research output: Contribution to journalArticlepeer-review

29 Scopus citations

Abstract

We present a simple and versatile patterning procedure for the reliable and reproducible fabrication of high aspect ratio (104) electrical interconnects that have separation distances down to 20 nm and lengths of several hundreds of microns. The process uses standard optical lithography techniques and allows parallel processing of many junctions, making it easily scalable and industrially relevant. We demonstrate the suitability of these nanotrenches as electrical interconnects for addressing micro and nanoparticles by realizing several circuits with integrated species. Furthermore, low impedance metal-metal low contacts are shown to be obtained when trapping a single metal-coated microsphere in the gap, emphasizing the intrinsic good electrical conductivity of the interconnects, even though a wet process is used. Highly resistive magnetite-based nanoparticles networks also demonstrate the advantage of the high aspect ratio of the nanotrenches for providing access to electrical properties of highly resistive materials, with leakage current levels below 1 pA.

Original languageEnglish (US)
Article number335303
JournalNanotechnology
Volume21
Issue number33
DOIs
StatePublished - Aug 20 2010

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