NATURAL CONVECTION HEAT TRANSFER FROM A CONDUCTING FIN ABOVE A HEATED HORIZONTAL CYLINDER.

A. K. Tolpadi; S. S. Kwon; T. H. Kuehn

NATURAL CONVECTION HEAT TRANSFER FROM A CONDUCTING FIN ABOVE A HEATED HORIZONTAL CYLINDER.

A. K. Tolpadi, S. S. Kwon, T. H. Kuehn

Mechanical Engineering

Research output: Contribution to journal › Conference article › peer-review

1 Scopus citations

Abstract

In electronics industry miniaturization, the problem of component cooling by natural convection is of importance. Electronic chips behave as local thermal sources and dissipation of heat through fins is widely used. Effects of fin length and fin conduction parameter are studied independently. While the cylinder plume has an influence on the fin, the fin has an insignificant effect on the local heat transfer variation around the cylinder.

Original language	English (US)
Pages (from-to)	85-90
Number of pages	6
Journal	American Society of Mechanical Engineers, Heat Transfer Division, (Publication) HTD
Volume	32
State	Published - Dec 1 1984

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title = "NATURAL CONVECTION HEAT TRANSFER FROM A CONDUCTING FIN ABOVE A HEATED HORIZONTAL CYLINDER.",

abstract = "In electronics industry miniaturization, the problem of component cooling by natural convection is of importance. Electronic chips behave as local thermal sources and dissipation of heat through fins is widely used. Effects of fin length and fin conduction parameter are studied independently. While the cylinder plume has an influence on the fin, the fin has an insignificant effect on the local heat transfer variation around the cylinder.",

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year = "1984",

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AU - Kuehn, T. H.

PY - 1984/12/1

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N2 - In electronics industry miniaturization, the problem of component cooling by natural convection is of importance. Electronic chips behave as local thermal sources and dissipation of heat through fins is widely used. Effects of fin length and fin conduction parameter are studied independently. While the cylinder plume has an influence on the fin, the fin has an insignificant effect on the local heat transfer variation around the cylinder.

AB - In electronics industry miniaturization, the problem of component cooling by natural convection is of importance. Electronic chips behave as local thermal sources and dissipation of heat through fins is widely used. Effects of fin length and fin conduction parameter are studied independently. While the cylinder plume has an influence on the fin, the fin has an insignificant effect on the local heat transfer variation around the cylinder.

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ER -

NATURAL CONVECTION HEAT TRANSFER FROM A CONDUCTING FIN ABOVE A HEATED HORIZONTAL CYLINDER.

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