Novel broadband through silicon via interconnect for three dimensional CPW transition

Young Seek Cho, Rhonda R. Franklin

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

A novel broadband through silicon via (TSV) interconnect is proposed for three dimensional coplanar waveguide (CPW) transition. Simple truncation of CPW ground plane in the transition region to the via size improves return and insertion loss of the three dimensional CPW transition. The characteristic impedance in the TSV interconnect is evaluated and optimum position of GND via hole is found by three dimensional electromagnetic simulations. Performance of the back-to-back novel TSV interconnect is characterized by simulations and measurements. The return loss of the novel TSV interconnect is below 20 dB over 88 % of a 50 GHz bandwidth. The return loss is improved by 10 dB and the insertion loss is well behaved response up to 25 GHz and better than 0.2 dB/mm across the 50 GHz band.

Original languageEnglish (US)
Title of host publicationEuropean Microwave Week 2010, EuMW2010
Subtitle of host publicationConnecting the World, Conference Proceedings - European Microwave Conference, EuMC 2010
Pages113-116
Number of pages4
StatePublished - Dec 17 2010
Event13th European Microwave Week 2010, EuMW2010: Connecting the World - 40th European Microwave Conference, EuMC 2010 - Paris, France
Duration: Sep 28 2010Sep 30 2010

Publication series

NameEuropean Microwave Week 2010, EuMW2010: Connecting the World, Conference Proceedings - European Microwave Conference, EuMC 2010

Other

Other13th European Microwave Week 2010, EuMW2010: Connecting the World - 40th European Microwave Conference, EuMC 2010
CountryFrance
CityParis
Period9/28/109/30/10

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