Physical design automation challenges for 3D ICs

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Scopus citations

Abstract

Recent advances in process technology have brought forth several options that have brought three-dimensional (3D) circuits within the realm of the possible and probable. This new design paradigm will require a major change in design methodologies, and an optimal 3D design will look very different from an optimal 2D design. Since the move from conventional 2D to 3D is inherently a topological change, it stands to reason that a number of SD-specific problems lie in the domain of physical design. This paper addresses challenges related to physical design for 3D integrated circuits.

Original languageEnglish (US)
Title of host publication2006 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT'06
PublisherIEEE Computer Society
ISBN (Print)1424400988, 9781424400980
DOIs
StatePublished - 2006
Event Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference - Padova, Italy
Duration: May 24 2006May 26 2006

Publication series

Name2006 IEEE International Conference on Integrated Circuit Design and Technology, ICICDT'06

Conference

Conference Integrated Circuit Design and Technology, 2006. ICICDT '06. 2006 IEEE International Conference
CountryItaly
CityPadova
Period5/24/065/26/06

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