Recent developments in thin film adhesion measurement

Megan J. Cordill, David F. Bahr, Neville R. Moody, William W. Gerberich

Research output: Contribution to journalArticlepeer-review

62 Scopus citations

Abstract

Interfacial fracture energies of thin films may be calculated using many different techniques. Nanoindentation and stressed overlayers are by far the most common and more reliable of the testing techniques. They depend on mechanics-based models to calculate the interfacial fracture energy of an interface using only the site specific material properties and the dimensions of the delaminated region, either in spontaneous buckle or indentation-induced blister form. This study will focus on four adhesion measurement techniques: spontaneous buckles, stressed overlayer-induced buckles, and nanoindentation-induced blisters with and without stressed overlayers, to demonstrate that the techniques will produce similar results for the measurement of adhesion energy. Films of tungsten (W), platinum (Pt), and titanium (Ti) on SiO2 (amorphous glass) substrates are examined and values of interfacial fracture energies reported. Results of interfacial fracture energy calculated from spontaneous buckles and indentation-induced blisters compare well to one another and values are reported for the aforementioned films.

Original languageEnglish (US)
Pages (from-to)163-168
Number of pages6
JournalIEEE Transactions on Device and Materials Reliability
Volume4
Issue number2
DOIs
StatePublished - Jun 2004

Bibliographical note

Funding Information:
Manuscript received February 17, 2004; revised March 15, 2004. The work of M. J. Cordill and D. F. Bahr was supported in part by the U.S. Department of Energy through the PECASE program under Contract DE-AC04-94AL85000. The work of M. J. Cordill and W. W. Gerberich was supported in part by the National Science Foundation under Contract NSF CMS 0322436.

Keywords

  • Adhesion
  • Interfacial fracture energy
  • Nanoindentation
  • Thin films

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