Screen Printing of Highly Loaded Silver Inks on Plastic Substrates Using Silicon Stencils

Woo Jin Hyun, Sooman Lim, Bok Yeop Ahn, Jennifer A. Lewis, C. Daniel Frisbie, Lorraine F. Francis

Research output: Contribution to journalArticlepeer-review

69 Scopus citations

Abstract

Screen printing is a potential technique for mass-production of printed electronics; however, improvement in printing resolution is needed for high integration and performance. In this study, screen printing of highly loaded silver ink (77 wt %) on polyimide films is studied using fine-scale silicon stencils with openings ranging from 5 to 50 ωm wide. This approach enables printing of high-resolution silver lines with widths as small as 22 μm. The printed silver lines on polyimide exhibit good electrical properties with a resistivity of 5.5 × 10-6 ω cm and excellent bending tolerance for bending radii greater than 5 mm (tensile strains less than 0.75%).

Original languageEnglish (US)
Pages (from-to)12619-12624
Number of pages6
JournalACS Applied Materials and Interfaces
Volume7
Issue number23
DOIs
StatePublished - Jun 17 2015

Keywords

  • plastic substrates
  • printed electronics
  • screen printing
  • silicon stencils
  • silver ink

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