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Abstract
Multifunctional 3D microstructures have been extensively investigated for the development of new classes of electronic and optical devices. Here, functionalized, free-standing, hollow, 3D, dielectric (150 nm thick aluminum oxide) microcontainers with metal patterning on their surfaces are realized by an evolved self-assembly approach. To functionalize the 3D structure and use it as a device, metal patterns, arrays of split-ring resonators (SRRs) acting as metamaterials, are defined on the surface of the 3D dielectric microcontainers. The SRRs on all six facets of a given microcube show a resonant behavior in terahertz regimes. Since desired metal and semiconductor patterns can be incorporated onto surfaces of 3D dielectric microstructures, this self-assembly process can be harnessed in developing next-generation microdevices utilizing the numerous advantages of 3D configurations.
Original language | English (US) |
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Article number | 1500459 |
Journal | Advanced Electronic Materials |
Volume | 2 |
Issue number | 6 |
DOIs | |
State | Published - Jun 1 2016 |
Bibliographical note
Publisher Copyright:© 2016 WILEY-VCH Verlag GmbH & Co. KGaA, Weinheim
Keywords
- 3D microstructures
- functionalization
- self-assembly
- surface patterning
- THz split ring resonators
How much support was provided by MRSEC?
- Primary
Reporting period for MRSEC
- Period 3