Strain in electroless copper films monitored by X-ray diffraction during and after deposition and its dependence on bath chemistry

Engineering & Materials Science

• X ray diffraction 100%
• Copper 82%
• Plating 56%
• Film growth 53%
• Electrolytes 49%
• Tensile strain 41%
• Relaxation 31%
• Nitrogen compounds 27%
• Cyanides 25%
• Crystallites 24%
• Substrates 23%
• Electroless plating 22%
• Strain measurement 20%
• Ions 15%
• X rays 15%
• Polymers 12%
• Monitoring 9%

Physics & Astronomy

• baths 91%
• chemistry 87%
• copper 72%
• diffraction 54%
• x rays 45%
• plating 42%
• electrolytes 31%
• nitrogen compounds 20%
• electroless deposition 18%
• cyanides 17%
• strain measurement 14%
• cells 13%
• crystallites 11%
• formulations 8%
• polymers 7%
• ions 5%

Chemical Compounds

• Strain 71%
• Chemistry 59%
• X-Ray Diffraction 50%
• Liquid Film 49%
• Polycrystalline Solid 10%
• Crystallite 9%
• Reaction Yield 9%
• X-Ray 6%
• Ion 4%
• Surface 3%