Surface-mount component attachment for E-textiles

Mary Ellen Berglund; Julia Duvall; Cory Simon; Lucy E Dunne

doi:10.1145/2802083.2808413

Surface-mount component attachment for E-textiles

Mary Ellen Berglund, Julia Duvall, Cory Simon, Lucy E Dunne

Apparel Design

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

29 Scopus citations

Abstract

Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.

Original language	English (US)
Title of host publication	ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers
Publisher	Association for Computing Machinery, Inc
Pages	65-66
Number of pages	2
ISBN (Electronic)	9781450335782
DOIs	https://doi.org/10.1145/2802083.2808413
State	Published - Sep 7 2015
Event	19th ACM International Symposium on Wearable Computers, ISWC 2015 - Osaka, Japan Duration: Sep 7 2015 → Sep 11 2015

Publication series

Name	ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers

Other

Other	19th ACM International Symposium on Wearable Computers, ISWC 2015
Country/Territory	Japan
City	Osaka
Period	9/7/15 → 9/11/15

Bibliographical note

Funding Information:
This research was supported by the National Science Foundation under grant #CNS-1253581.

Publisher Copyright:
© Copyright 2015 ACM.

Access

10.1145/2802083.2808413

OpenUrl availability

Full text

Cite this

Berglund, M. E., Duvall, J., Simon, C., & Dunne, L. E. (2015). Surface-mount component attachment for E-textiles. In ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers (pp. 65-66). (ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers). Association for Computing Machinery, Inc. https://doi.org/10.1145/2802083.2808413

Surface-mount component attachment for E-textiles. / Berglund, Mary Ellen; Duvall, Julia; Simon, Cory et al.
ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers. Association for Computing Machinery, Inc, 2015. p. 65-66 (ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Berglund, ME, Duvall, J, Simon, C & Dunne, LE 2015, Surface-mount component attachment for E-textiles. in ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers. ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers, Association for Computing Machinery, Inc, pp. 65-66, 19th ACM International Symposium on Wearable Computers, ISWC 2015, Osaka, Japan, 9/7/15. https://doi.org/10.1145/2802083.2808413

@inproceedings{1c4c82cde8de4dff8188ede731d89cf5,

title = "Surface-mount component attachment for E-textiles",

abstract = "Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount {"}fabric PCBs{"} using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.",

author = "Berglund, {Mary Ellen} and Julia Duvall and Cory Simon and Dunne, {Lucy E}",

note = "Funding Information: This research was supported by the National Science Foundation under grant #CNS-1253581. Publisher Copyright: {\textcopyright} Copyright 2015 ACM.; 19th ACM International Symposium on Wearable Computers, ISWC 2015 ; Conference date: 07-09-2015 Through 11-09-2015",

year = "2015",

month = sep,

day = "7",

doi = "10.1145/2802083.2808413",

language = "English (US)",

series = "ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers",

publisher = "Association for Computing Machinery, Inc",

pages = "65--66",

booktitle = "ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers",

}

TY - GEN

T1 - Surface-mount component attachment for E-textiles

AU - Berglund, Mary Ellen

AU - Duvall, Julia

AU - Simon, Cory

AU - Dunne, Lucy E

PY - 2015/9/7

Y1 - 2015/9/7

N2 - Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.

AB - Integration of electronic components into textile structures is a key requirement for smart clothing applications, particularly those in which electronics must be distributed over the body surface. Scalable manufacturing techniques for textile-integration of components are a key need in the wearables industry. Here, we introduce a novel technique for assembling surface-mount "fabric PCBs" using stitched traces and reflow soldering techniques. We present an initial evaluation of the durability of this method comparing three variables of manufacture. Results show that all configurations are sufficiently durable for low-intensity wear, and for high-intensity wear larger components and traces and perpendicular trace layout improve durability.

UR - http://www.scopus.com/inward/record.url?scp=84960372309&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=84960372309&partnerID=8YFLogxK

U2 - 10.1145/2802083.2808413

DO - 10.1145/2802083.2808413

M3 - Conference contribution

AN - SCOPUS:84960372309

T3 - ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers

SP - 65

EP - 66

BT - ISWC 2015 - Proceedings of the 2015 ACM International Symposium on Wearable Computers

PB - Association for Computing Machinery, Inc

T2 - 19th ACM International Symposium on Wearable Computers, ISWC 2015

Y2 - 7 September 2015 through 11 September 2015

ER -

Surface-mount component attachment for E-textiles

Abstract

Publication series

Other

Bibliographical note

Access

OpenUrl availability

Other files and links

Fingerprint

Cite this