The effects of decreasing layer thickness on the high temperature mechanical behavior of Cu / Nb nanoscale multilayers

N. A. Mara, T. Tamayo, A. V. Sergueeva, X. Zhang, A. Misra, A. K. Mukherjee

Research output: Contribution to journalArticlepeer-review

38 Scopus citations

Abstract

The microstructure and high temperature mechanical behavior of textured, polycrystalline Cu-Nb nanolayered composites prepared by magnetron sputtering were evaluated. Layer thicknesses of 75, 60, and 40 nm were tested in an effort to investigate the high temperature mechanical properties of freestanding thin film multilayers. Effects of decreasing layer thickness on high temperature properties show a dependence of strength and ductility on layer thickness and test temperature. Fracture surface analysis, along with strain rate jump test results, show boundary sliding as a probable deformation mechanism under certain conditions. The role of elevated-temperature deformation mechanisms such as interlayer and grain boundary sliding are discussed.

Original languageEnglish (US)
Pages (from-to)3241-3245
Number of pages5
JournalThin Solid Films
Volume515
Issue number6
DOIs
StatePublished - Feb 12 2007

Bibliographical note

Funding Information:
This investigation is supported by the National Science Foundation, grant # NSF-DMR-0240144 and LANL CARE grant #69757. Work at LANL is supported by DOE, Office of Basic Energy Sciences.

Keywords

  • Copper
  • Multilayers
  • Nanostructures
  • Niobium

Fingerprint Dive into the research topics of 'The effects of decreasing layer thickness on the high temperature mechanical behavior of Cu / Nb nanoscale multilayers'. Together they form a unique fingerprint.

Cite this