Abstract
Wideband vertical interconnects are needed for high density packaging of 3-dimensional designs in electronic and optoelectronic applications. A DC-50 GHz through-wafer transmission line based on a coplanar waveguide configuration is presented. Wideband operation is achieved by printing a CPW on the sidewall of a wet etched cavity. Simulated and measured results are given for several vertical interconnects. The best design exhibits a 0.1 dB loss per vertical interconnect at 40 GHz and a return loss greater than 19 dB from 0.45-50 GHz.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 489-492 |
| Number of pages | 4 |
| Journal | IEEE MTT-S International Microwave Symposium Digest |
| Volume | 2 |
| State | Published - Sep 20 2004 |
| Event | 2004 IEEE MITT-S International Microwave Symposium Digest - Fort Worth, TX, United States Duration: Jun 6 2004 → Jun 11 2004 |
Keywords
- Coplanar waveguides
- Interconnections
- Packaging
- Three-dimensional interconnects
- Through-wafer interconnects