@inproceedings{1d6339967d2a4932951542084f6a2339,
title = "Wafer packing for full mask exposure fabrication",
abstract = "The authors formulate and classify the various models of the wafer packing problem for the full mask exposure technique. Since the wafer packing problem is NP-hard, the authors propose a good heuristic for it. Their experiments, on real test data, indicate that this heuristic is very effective as it provides considerable cost reduction when compared with the traditional way of producing chips.",
author = "Wu, {Ching Ting} and Andrew Lim and David Du",
year = "1992",
month = dec,
day = "1",
language = "English (US)",
isbn = "0818621575",
series = "1991 IEEE International Conference on Computer-Aided Design Digest of Technical Papers",
publisher = "Publ by IEEE",
pages = "52--55",
booktitle = "1991 IEEE International Conference on Computer-Aided Design Digest of Technical Papers",
note = "1991 IEEE International Conference on Computer-Aided Design - ICCAD-91 ; Conference date: 11-11-1991 Through 14-11-1991",
}