Wall superheat excursions in the boiling incipience of dielectric fluids

Avram Bar-Cohen, Terrence W Simon

Research output: Contribution to journalArticlepeer-review

42 Scopus citations


Many of the candidate fluids for immersion cooling of microelectronic components possess both low surface tension and high gas solubility. As a consequence, ebullient heat transfer with such fluids is accompanied by nucleation anomalies and a frequently observed wall temperature overshoot. The difficulty in preventing this thermal excursion and in predicting its magnitude constrains the development of immersion cooling systems. This paper begins with a brief review of the mechanisms that may be responsible for delayed nucleation and examines the limited literature on incipience superheat excursions.

Original languageEnglish (US)
Pages (from-to)19-31
Number of pages13
JournalHeat Transfer Engineering
Issue number3
StatePublished - Jun 1988

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