TY - GEN
T1 - Wireless 3D vertical interconnect with power splitting capability
AU - Dave, Aditya
AU - Franklin, Rhonda
N1 - Publisher Copyright:
© 2020 IEEE.
Copyright:
Copyright 2020 Elsevier B.V., All rights reserved.
PY - 2020/8
Y1 - 2020/8
N2 - Power generation reduces at millimeter wave frequencies for emerging system applications, such as 5G. Thus, loss presents many design challenges for complex integrated system design. This paper proposes to alleviate loss associated with vertical interconnects used in such systems. A wireless equal split 3D vertical power divider that offers very low loss is presented. Two near field beams, produced by one source element and a novel frequency selective surface (FSS), are detected by individual receive elements of the same type. This design is scalable, modeled at 13.5GHz and 60GHz. A 13.5GHz scale model is demonstrated for validation. Simulated insertion loss coefficient at 13.5GHz is 3.24dB, with bandwidth of 5.5%. Modeled and measured results are in good agreement.
AB - Power generation reduces at millimeter wave frequencies for emerging system applications, such as 5G. Thus, loss presents many design challenges for complex integrated system design. This paper proposes to alleviate loss associated with vertical interconnects used in such systems. A wireless equal split 3D vertical power divider that offers very low loss is presented. Two near field beams, produced by one source element and a novel frequency selective surface (FSS), are detected by individual receive elements of the same type. This design is scalable, modeled at 13.5GHz and 60GHz. A 13.5GHz scale model is demonstrated for validation. Simulated insertion loss coefficient at 13.5GHz is 3.24dB, with bandwidth of 5.5%. Modeled and measured results are in good agreement.
KW - Frequency selective surface
KW - Interconnects
KW - Packaging
KW - Power divider
KW - Slot antennas
KW - Wireless
UR - http://www.scopus.com/inward/record.url?scp=85094182551&partnerID=8YFLogxK
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U2 - 10.1109/IMS30576.2020.9223936
DO - 10.1109/IMS30576.2020.9223936
M3 - Conference contribution
AN - SCOPUS:85094182551
T3 - IEEE MTT-S International Microwave Symposium Digest
SP - 1161
EP - 1163
BT - IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2020 IEEE/MTT-S International Microwave Symposium, IMS 2020
Y2 - 4 August 2020 through 6 August 2020
ER -