Abstract
Power generation reduces at millimeter wave frequencies for emerging system applications, such as 5G. Thus, loss presents many design challenges for complex integrated system design. This paper proposes to alleviate loss associated with vertical interconnects used in such systems. A wireless equal split 3D vertical power divider that offers very low loss is presented. Two near field beams, produced by one source element and a novel frequency selective surface (FSS), are detected by individual receive elements of the same type. This design is scalable, modeled at 13.5GHz and 60GHz. A 13.5GHz scale model is demonstrated for validation. Simulated insertion loss coefficient at 13.5GHz is 3.24dB, with bandwidth of 5.5%. Modeled and measured results are in good agreement.
Original language | English (US) |
---|---|
Title of host publication | IMS 2020 - 2020 IEEE/MTT-S International Microwave Symposium |
Publisher | Institute of Electrical and Electronics Engineers Inc. |
Pages | 1161-1163 |
Number of pages | 3 |
ISBN (Electronic) | 9781728168159 |
DOIs | |
State | Published - Aug 2020 |
Externally published | Yes |
Event | 2020 IEEE/MTT-S International Microwave Symposium, IMS 2020 - Virtual, Los Angeles, United States Duration: Aug 4 2020 → Aug 6 2020 |
Publication series
Name | IEEE MTT-S International Microwave Symposium Digest |
---|---|
Volume | 2020-August |
ISSN (Print) | 0149-645X |
Conference
Conference | 2020 IEEE/MTT-S International Microwave Symposium, IMS 2020 |
---|---|
Country/Territory | United States |
City | Virtual, Los Angeles |
Period | 8/4/20 → 8/6/20 |
Bibliographical note
Publisher Copyright:© 2020 IEEE.
Keywords
- Frequency selective surface
- Interconnects
- Packaging
- Power divider
- Slot antennas
- Wireless