Young's modulus measurement of thin film PZT

Jia Zhou; Trevor McMcollough; Susan C. Mantell; Shayne Zurn

Young's modulus measurement of thin film PZT

Jia Zhou, Trevor McMcollough, Susan C. Mantell, Shayne Zurn

Mechanical Engineering

Research output: Contribution to journal › Conference article › peer-review

9 Scopus citations

Abstract

In this paper, experimental measurements of the modulus for thin film PZT are presented. Several wafers with PZT patterned over Pt/Ti/SiO₂ were fabricated. In each wafer, circular membranes of diameters ranging from 668 μm to 1667 μm were constructed using reactive ion etching. Film moduli for the various material layers were found by measuring membrane deflection under a concentrated load. Layer thickness was verified using SEM. To account for the initial curvature in the membrane, the relationship between load, deflection and stiffness was approximated by a spherical shell model. These stiffness values provided the basis for predicting micro cantilever beam vibration behavior.

Original language	English (US)
Pages (from-to)	153-157
Number of pages	5
Journal	Biennial University/Government/Industry Microelectronics Symposium - Proceedings
State	Published - 1999
Event	Proceedings of the 1999 13th Biennial University / Goverment / Industry Microelectronics Symposium (UGIM) - Minneapolis, MN, USA Duration: Jun 20 1999 → Jun 23 1999

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title = "Young's modulus measurement of thin film PZT",

abstract = "In this paper, experimental measurements of the modulus for thin film PZT are presented. Several wafers with PZT patterned over Pt/Ti/SiO2 were fabricated. In each wafer, circular membranes of diameters ranging from 668 μm to 1667 μm were constructed using reactive ion etching. Film moduli for the various material layers were found by measuring membrane deflection under a concentrated load. Layer thickness was verified using SEM. To account for the initial curvature in the membrane, the relationship between load, deflection and stiffness was approximated by a spherical shell model. These stiffness values provided the basis for predicting micro cantilever beam vibration behavior.",

author = "Jia Zhou and Trevor McMcollough and Mantell, {Susan C.} and Shayne Zurn",

note = "Copyright: Copyright 2004 Elsevier Science B.V., Amsterdam. All rights reserved.; Proceedings of the 1999 13th Biennial University / Goverment / Industry Microelectronics Symposium (UGIM) ; Conference date: 20-06-1999 Through 23-06-1999",

year = "1999",

language = "English (US)",

pages = "153--157",

journal = "Biennial University/Government/Industry Microelectronics Symposium - Proceedings",

issn = "0749-6877",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - JOUR

T1 - Young's modulus measurement of thin film PZT

AU - Zhou, Jia

AU - McMcollough, Trevor

AU - Mantell, Susan C.

AU - Zurn, Shayne

PY - 1999

Y1 - 1999

N2 - In this paper, experimental measurements of the modulus for thin film PZT are presented. Several wafers with PZT patterned over Pt/Ti/SiO2 were fabricated. In each wafer, circular membranes of diameters ranging from 668 μm to 1667 μm were constructed using reactive ion etching. Film moduli for the various material layers were found by measuring membrane deflection under a concentrated load. Layer thickness was verified using SEM. To account for the initial curvature in the membrane, the relationship between load, deflection and stiffness was approximated by a spherical shell model. These stiffness values provided the basis for predicting micro cantilever beam vibration behavior.

AB - In this paper, experimental measurements of the modulus for thin film PZT are presented. Several wafers with PZT patterned over Pt/Ti/SiO2 were fabricated. In each wafer, circular membranes of diameters ranging from 668 μm to 1667 μm were constructed using reactive ion etching. Film moduli for the various material layers were found by measuring membrane deflection under a concentrated load. Layer thickness was verified using SEM. To account for the initial curvature in the membrane, the relationship between load, deflection and stiffness was approximated by a spherical shell model. These stiffness values provided the basis for predicting micro cantilever beam vibration behavior.

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M3 - Conference article

AN - SCOPUS:0032670168

SP - 153

EP - 157

JO - Biennial University/Government/Industry Microelectronics Symposium - Proceedings

JF - Biennial University/Government/Industry Microelectronics Symposium - Proceedings

SN - 0749-6877

T2 - Proceedings of the 1999 13th Biennial University / Goverment / Industry Microelectronics Symposium (UGIM)

Y2 - 20 June 1999 through 23 June 1999

ER -