A fixed-die floorplanning algorithm using an analytical approach

Yong Zhan, Yan Feng, Sachin S. Sapatnekar

Research output: Chapter in Book/Report/Conference proceedingConference contribution

21 Scopus citations

Abstract

Fixed-die floorplanning is an important problem in the modern physical design process. An effective floorplanning algorithm is crucial to improving both the quality and the timeto-market of the design. In this paper, we present an analytical floorplanning algorithm that can be used to efficiently pack soft modules into a fixed die. The locations and sizing of the modules are simultaneously optimized so that a minimum total wire length is achieved. Experiments on the MCNC and GSRC benchmarks show that our algorithm can achieve above a 90% success rate with a 10% white space constraint in the fixed die, and the efficiency is much higher than that of the simulated annealing based algorithms for benchmarks containing a large number of modules.

Original languageEnglish (US)
Title of host publicationProceedings of the ASP-DAC 2006
Subtitle of host publicationAsia and South Pacific Design Automation Conference 2006
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages771-776
Number of pages6
ISBN (Print)0780394518, 9780780394513
DOIs
StatePublished - 2006
EventASP-DAC 2006: Asia and South Pacific Design Automation Conference 2006 - Yokohama, Japan
Duration: Jan 24 2006Jan 27 2006

Publication series

NameProceedings of the Asia and South Pacific Design Automation Conference, ASP-DAC
Volume2006

Other

OtherASP-DAC 2006: Asia and South Pacific Design Automation Conference 2006
CountryJapan
CityYokohama
Period1/24/061/27/06

Fingerprint Dive into the research topics of 'A fixed-die floorplanning algorithm using an analytical approach'. Together they form a unique fingerprint.

Cite this