A novel dual-axis electrostatic microactuation system for micromanipulation

Yu Sun, D. Piyabongkarn, A. Sezen, B. J. Nelson, R. Rajamani, R. Schoch, D. P. Potasek

Research output: Contribution to conferencePaperpeer-review

23 Scopus citations

Abstract

This paper presents the design, fabrication, modeling, and control of a dual-axis electrostatic microactuation system. To form the 3-D structure only three masks are used on silicon-on-insulator (SOI) wafers using Deep Reactive Ion Etching (DRIE). The bulk micromachined high aspect ratio structure produces large force output, achieving the full motion range with 10.7V in x and 70.1V in y. To provide position feedback for high precision manipulation, a capacitive position sensing mechanism, capable of resolving position changes up to 5 μm with a resolution of 0.01 μm in both x and y is integrated. A nonlinear model inversion technique is proposed for nonlinear electrostatic microactuation system identification and improving system linearity and response. The effectiveness of the technique has been verified in experiments. The application of the system is for micromanipulation and microassembly.

Original languageEnglish (US)
Pages1796-1801
Number of pages6
StatePublished - Jan 1 2002
Event2002 IEEE/RSJ International Conference on Intelligent Robots and Systems - Lausanne, Switzerland
Duration: Sep 30 2002Oct 4 2002

Other

Other2002 IEEE/RSJ International Conference on Intelligent Robots and Systems
CountrySwitzerland
CityLausanne
Period9/30/0210/4/02

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