This paper presents the design, fabrication, modeling, and control of a dual-axis electrostatic microactuation system. To form the 3-D structure only three masks are used on silicon-on-insulator (SOI) wafers using Deep Reactive Ion Etching (DRIE). The bulk micromachined high aspect ratio structure produces large force output, achieving the full motion range with 10.7V in x and 70.1V in y. To provide position feedback for high precision manipulation, a capacitive position sensing mechanism, capable of resolving position changes up to 5 μm with a resolution of 0.01 μm in both x and y is integrated. A nonlinear model inversion technique is proposed for nonlinear electrostatic microactuation system identification and improving system linearity and response. The effectiveness of the technique has been verified in experiments. The application of the system is for micromanipulation and microassembly.
|Original language||English (US)|
|Number of pages||6|
|State||Published - Jan 1 2002|
|Event||2002 IEEE/RSJ International Conference on Intelligent Robots and Systems - Lausanne, Switzerland|
Duration: Sep 30 2002 → Oct 4 2002
|Other||2002 IEEE/RSJ International Conference on Intelligent Robots and Systems|
|Period||9/30/02 → 10/4/02|