An ultra-dense irradiation test structure with a NAND/NOR readout chain for characterizing soft error rates of 14nm combinational logic circuits

Saurabh Kumar, Minki Cho, Luke Everson, Hoonki Kim, Qianying Tang, Paul Mazanec, Pascal Meinerzhagen, Andres Malavasi, Dan Lake, Carlos Tokunaga, Muhammad Khellah, James Tschanz, Shekhar Borkar, Vivek De, Chris H. Kim

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

This paper describes a 14nm test chip employing a novel NAND/NOR readout chain for characterizing soft error rate (SER) in combinational logic gates. The proposed test structure uses high density standard logic gates as detection circuit for sensing Single Event Transients (SETs) that are then forwarded to a skewed NAND-NOR readout chain which funnels all SET pulses while expanding the pulse width to ensure they reach the final triple modular redundant (TMR) counter. The proposed circuit is compact, has a scalable architecture based on a unit cell layout, and incurs minimal area overhead. Different gate configurations (device size, threshold voltage, fan-out and chain length) were implemented in the 14nm test-chip and irradiated under a neutron beam to collect a massive amount of statistical data. Radiation data captures, for the first time, the impact of various circuit parameters on combinational logic SER in 14nm tri-gate technology.

Original languageEnglish (US)
Title of host publication2017 IEEE International Electron Devices Meeting, IEDM 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages39.3.1-39.3.4
ISBN (Electronic)9781538635599
DOIs
StatePublished - Jan 23 2018
Event63rd IEEE International Electron Devices Meeting, IEDM 2017 - San Francisco, United States
Duration: Dec 2 2017Dec 6 2017

Publication series

NameTechnical Digest - International Electron Devices Meeting, IEDM
ISSN (Print)0163-1918

Other

Other63rd IEEE International Electron Devices Meeting, IEDM 2017
Country/TerritoryUnited States
CitySan Francisco
Period12/2/1712/6/17

Bibliographical note

Publisher Copyright:
© 2017 IEEE.

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