Computer-Aided Design for 3D Circuits at the University of Minnesota

Research output: Chapter in Book/Report/Conference proceedingChapter

1 Scopus citations
Original languageEnglish (US)
Title of host publicationHandbook of 3D Integration
Subtitle of host publicationTechnology and Applications of 3D Integrated Circuits
PublisherJohn Wiley and Sons
Pages583-597
Number of pages15
Volume2
ISBN (Print)9783527320349
DOIs
StatePublished - Nov 25 2008

Keywords

  • 3D circuits
  • Computer-aided design
  • Power grid
  • Thermal analysis

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